Multi-Mix^®

Innovative

Multi-Mix Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM^®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Multilayer

The bonded multilayers, with embedded semiconductor devices, MMICs, etched resistors, circuit patterns and plated-through via holes, form a surface mount module which requires no further packaging. In fact, the MMFM structure becomes the package. This small outline, low-profile structure is lightweight, and the surface-mount format is compatible with microstrip or coplanar waveguide.

Process

The process controls of the Multi-Mix methods allow a low cost manufacturing approach that is suitable for high or low volume production. The platform strategy of MMFM reduces engineering cycle time and enables the Multi-Mix process to be an economical solution for new designs.

Multi-Mix PICO^®

Multi-Mix PICO is the next big leap for Multi-Mix technology. Multi-Mix PICO reduces the size of single-function microwave components from 84% to 87% compared to the previous Multi-Mix designs, which were until now the smallest in the industry. Merrimac accomplishes this without sacrificing performance. Multi-Mix PICO provides the highest power handling ability in the smallest footprint and overall size, and at the lowest cost of any other multilayer construction. Orders of magnitude reduction in size and cost provide greater value to our customers, which can be passed on to their customers. Please visit the Multi-Mix PICO section of our Web site.

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