Microelectronics Solutions, Interpoint hybrid advanced electronic assembly

Microelectronics Solutions

Overview Capabilities Markets Served Benefits Trade References

Crane Microelectronics Solutions specializes in custom advanced electronic assembly and packaging solutions. Crane offers 40+ years of Microelectronic and Hybrid assembly capability. We also offer full MIL-STD-883 qualification testing, design services, turnkey services and complete test capability. Our customers utilize Crane’s unique capabilities and competencies to achieve size reduction, weight reduction, increase signal and power performance, improve reliability and resolving circuit density challenges.

Crane works with a variety of applications in the Aerospace, Defense, Medical, Industrial and Commercial markets that require our ability to provide full turnkey services, co-develop and build-to-print.
Our facility is ITAR registered and certified to MIL-PRF-38534 Class H and K, ISO 13485, as well as to ISO 9001 and AS9100 assuring quality in all our services including design, development, assembly and test.
Crane offers full turnkey design, assembly, material purchasing, qualification and test services.
Crane is an established hybrid, microelectronic and electronic assembly services provider.
We were formally Interpoint^®; one of the early legacy hybrid manufacturers.
We constantly meet our customers time-to-market and time-to-volume demands.
Crane utilizes capabilities such as die and wirebond processing, flip chip processing, 3D wafer technology, CSP (Chip Scale packaging), 01005 passive component placement, SiP, PoP and obsolescence redesign including RoHS conversion.
Let us Shrink your electronic assemblies and hybrid circuits.

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Microelectronics Solutions

Capabilities

Advanced, high-density microelectronic module assembly
Design for Manufacturing (DFM) and Design for Test (DFT) Validation protocol to ensure quality and reliability
Thick film technology
Surface mount or mixed technology assembly
Chip and Wire, Chip on Board, Chip on Flex
uBGA, Flip Chip, Chip Scale Package (CSP)
Program management and engineering support from design inception through product life cycle
Test system development
Re-design for obsolescence
ISO 9001 / AS 9100 Certified Facilities
ISO 13485 Certified Domestic Facility
MIL-PRF-38534 Class H & K Certified Domestic Facility
MIL-PRF-38534 Class H Certified Offshore Facility
ITAR registered

Examples of our Capabilities

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Medical

Medical Implantable Devices

- Cardiac Rhythm Management

Implants Pacemakers

Defibrillators

- Neurostimulation Implants

Spinal Cord Stimulation (SCS)

Deep Brain Stimulation (DBS)

Vagus Nerve Stimulation (VNS)

- Cochlear Implants

Aerospace
Commercial
Defense
Industrial

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40+ years of high reliability multi-chip hybrid module assembly experience
Lean Manufacturing / Operational Excellence / 6 Sigma Process Controls
Best in Class Advanced Electronic Assembly Supplier
Leading Edge Process Engineering Technology Innovations
Design for Manufacturing (DFM) and Design for Test (DFT) validation protocol to ensure quality and reliability
Turn-key hi-rel suppler of choice
Re-design and component obsolescence management
Program management
Product support from design inception through product life cycle
Diversified technology portfolio
ISO 9001 / AS 9100 certified facilities
ISO 13485 certified
MIL-PRF-38534 facilities:
- Domestic: Class H and K
- Off-Shore: Class H
ITAR registered

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Below are some useful links for organizations that govern our technology, markets and quality standards.

Interpoint^® DC/DC Converters
DLA – (Former DSCC ) Defense Logistics Agency for
MIL-38534, MIL-883, QPL, QML and Cage Code Search
American National Standards Institute
US Department of State - ITAR
NANS - The North American Neuromodulation Society
INS – International Neuromodulation Society

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See Contact Us for our Microelectronics Solutions contacts or use the Ask the Expert button to request additional information about our Microelectronics Solutions.