Microelectronics Solutions

Product Development

A key to our success is our product team approach. At the start of each project, we assign a multifunctional Product Team. The partnership between this team and the customer leads to more efficient development cycles. The Interpoint team and the customer review the critical design cost drivers to optimize the design for cost reduction and manufacturability.

Product development steps:

• Review product requirements
• Generate project plan
• Establish program management
• Identify product acceptance criteria
• Determine product verification plan
• Transfer product to manufacturing
• Review/acceptance by customer
• Release to production

Production Lines

Our production lines have experienced teams using high-tech equipment for speed and reliability. For products requiring a clean-room environment, automatic die-attach and wirebond machines complement the manual portion of the assembly lines. Our automated blended-technology line provides high-speed, high-volume precision assembly of surface mount components, flip-chip, BGA, chip-on-board, and hybrids. Test fixtures and software designed by our engineers complete the line. All lines maintain an ESD safe environment.

A clean-room line:

Test

We optimize the circuit's testability by integrating:

• Circuit Design
• Layout
• Test Requirements

We conduct component-, assembly- and system-level testing that is designed to provide reliable information while maintaining quick production cycle times.

We design, fabricate, and develop software for our test systems. Specialized test fixtures allow testing at temperatures as low as -55°C without condensation or icing on any adaptors or connectors which maintains test data accuracy and adaptor/connector integrity.

Test development steps:

• Identify the parameters to be tested
• Identify the equipment needed for testing
• Create daily calibration procedure for test
• Identify and define ATE requirements,
• Validate ATE results for minimum Delta

Technologies

Substrates: we print & trim our own thick-film. We also use High temperature co-fired ceramic and Low temperature co-fired ceramic as well as PC Board, polyester and polymide.

Packages/Sealing: our sealing capabilities include laser welding, solder sealing and projection welding.

We can provide you with hermeticity on one or both sides, or if you wish, we can provide non-hermetically-sealed packages. We can utilize the ceramic substrate as the foundation for the package as well as encapsulate, glob top, conformal coat and provide custom solutions.

Additional Information

To find out how our Microelectronics Solutions can be used in your application, submit an inquiry to Ask the Expert.

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