The bonding process embeds MMICs, etched resistors, circuit patterns and plated-through holes to form a surface mount module requiring no further packaging. In fact, the MMFM structure becomes the package. This low-profile structure is very lightweight and the surface-mount format is compatible with microstrip or coplanar waveguide. The process controls of the Multi-Mix method allow a low-cost manufacturing approach that is suitable for high or low volume production. The platform strategy of MMFM reduces engineering cycle times and enables the Multi-Mix process to be an economical solution for new designs.