Product Development
A key to our success is our product team approach. At the start of each project,
we assign a multifunctional Product Team. The partnership between this team and
the customer leads to more efficient development cycles. The Interpoint team and
the customer review the critical design cost drivers to optimize the design for
cost reduction and manufacturability.
Product development steps:
- Review product requirements
- Generate project plan
- Establish program management
- Identify product acceptance criteria
- Determine product verification plan
- Transfer product to manufacturing
- Review/acceptance by customer
- Release to production
Production Lines
Our production lines have experienced teams using high-tech equipment for speed
and reliability. For products requiring a clean-room environment, automatic
die-attach and wirebond machines complement the manual portion of the assembly
lines. Our automated blended-technology line provides high-speed, high-volume
precision assembly of surface mount components, flip-chip, BGA, chip-on-board,
and hybrids. Test fixtures and software designed by our engineers complete the
line. All lines maintain an ESD safe environment.
A clean-room line:
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Reflow Section
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- Print solderpaste
- Place components and wires
- Solder reflow
- Clean/Inspect
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Automatic die attach: Palomar
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- Attach boards
- Daub epoxy
- Auto place components
- Cure epoxy
- Plasma clean
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Automatic wirebond: Palomar
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- Auto wirebond
- Dispense epoxy
- Place die
- Inspect/Cure
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Wirebond & Die Attach
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- Place/Attach sub-assemblies
- Test
- Seal
- Temp Cycle
- Final Test
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Test
 We optimize the circuit's testability by integrating:
- Circuit Design
- Layout
- Test Requirements
We conduct component-, assembly- and system-level testing that is designed to
provide reliable information while maintaining quick production cycle times.
We design, fabricate, and develop software for our test systems. Specialized
test fixtures allow testing at temperatures as low as -55°C without condensation
or icing on any adaptors or connectors which maintains test data accuracy and
adaptor/connector integrity.
Test development steps:
- Identify the parameters to be tested
- Identify the equipment needed for testing
- Create daily calibration procedure for test
- Identify and define ATE requirements,
- Validate ATE results for minimum Delta
Technologies
 Substrates: we print & trim our own thick-film. We also use
High temperature co-fired ceramic and Low temperature co-fired ceramic as well
as PC Board, polyester and polymide.
Packages/Sealing: our sealing capabilities include laser welding, solder sealing
and projection welding.
We can provide you with hermeticity on one or both sides, or if you wish, we can
provide non-hermetically-sealed packages. We can utilize the ceramic substrate
as the foundation for the package as well as encapsulate, glob top, conformal
coat and provide custom solutions.
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